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Brand Name : CSIMC
Model Number : Lithium Niobate (LiNbO3)
Certification : ISO:9001, ISO:14001
Place of Origin : China
MOQ : 10 pcs
Price : Negotiable
Payment Terms : T/T
Supply Ability : 10000 pcs/Month
Delivery Time : 1-4 weeks
Packaging Details : Cassette/ Jar package, vaccum sealed
Product : LiNbO3 Wafer
Diameter : 3'', 4'', 6'', 8''
Orientation Cut : Y128
Surface : Polish, Lap, Etch
Application : SAW, BAW, FBAR, Semiconductor, Optical
Thickness : 0.25mm - 3mm
Surface Ra : Ra<5 Angstrom
TTV : <5um
128Y Cut LiNbO3 Wafer for Optical and SAW Applications with High Reliability
Unlock the potential of your optical and microwave applications with our precision-crafted 128°Y-Cut LiNbO3 Wafers. These wafers, made from lithium niobate (LiNbO3), are specifically cut at a 128° angle to the Y-axis, optimizing their performance for a wide range of demanding applications.
Our 128°Y-Cut LiNbO3 Wafers offer exceptional optical and electro-optic properties, including high optical transparency, low absorption, and strong electro-optic coefficients. This makes them ideal for use in modulators, switches, filters, and other optical components.
The superior crystal quality and uniformity of our wafers ensure reliable and consistent performance, even under demanding operating conditions. Their stability and durability also make them suitable for long-term use in various environments.
Whether you're developing new optical systems or enhancing existing ones, our 128°Y-Cut LiNbO3 Wafers are the key to achieving superior performance and reliability. Contact us today to learn more about how our products can take your research or manufacturing process to the next level.
Material | LiNbO3 Crystal |
Orientation | X / Z / Y41° / Y64° / Y128° / YZ / YX or Customized |
Diameter | Φ76.2mm (3 inch); Φ100mm (4 inch); Φ150mm (6 inch) |
Surface finish | One / Both sides polish |
Thickness | 350±25um / 500±25um |
TTV | < 1~5µm |
BOW | ± (25µm ~40um ) |
Warp | <= 35µm |
LTV (5mmx5mm) | <1.5 um |
PLTV(<0.5um) | ≥98% (5mm*5mm) with 2mm edge excluded |
Edge | Compl't with SEMI M1.2@with GC800# .regular at C typed |
Orientation flats | available, per request |
Polished side Ra | Roughness Ra<=5A |
Back Side Criteria | Roughness Ra:0.5-1.0µm GC#1000 |
Edge Rounding | Compliant with SEMI M1.2 Standard/refer to IEC62276 |
Cracks, saw marks, stains | None |
Acceptance Check
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128Y Cut LiNbO3 Wafer for Optical and SAW Applications with High Reliability Images |